质量水平
检测方案
98%
形式
powder
反应适用性
core: silver
reagent type: catalyst
mp
257-260 °C (dec.) (lit.)
SMILES字符串
FC(F)(F)C(=O)O[Ag]
InChI
1S/C2HF3O2.Ag/c3-2(4,5)1(6)7;/h(H,6,7);/q;+1/p-1
InChI key
KZJPVUDYAMEDRM-UHFFFAOYSA-M
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应用
警示用语：
Danger
危险声明
危险分类
Acute Tox. 2 Oral - Aquatic Acute 1 - Aquatic Chronic 1
WGK
WGK 3
闪点(°F)
Not applicable
闪点(°C)
Not applicable
个人防护装备
dust mask type N95 (US), Eyeshields, Gloves
商品
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
We are proud to offer a treasure-trove of gold precatalysts and silver salts, as well as an extensive portfolio of unsaturated building blocks to accelerate your research success in this exciting field.
The properties of many devices are limited by the intrinsic properties of the materials that compose them.
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