所有图片(4)
About This Item
线性分子式:
Cu(C5H7O2)2
CAS号:
分子量:
261.76
Beilstein:
4157957
EC 号:
MDL编号:
UNSPSC代码:
12352103
PubChem化学物质编号:
NACRES:
NA.23
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质量水平
方案
97%
表单
powder
反应适用性
core: copper
reagent type: catalyst
mp
284-288 °C (dec.) (lit.)
SMILES字符串
CC(=O)\C=C(\C)O[Cu]O\C(C)=C/C(C)=O
InChI
1S/2C5H8O2.Cu/c2*1-4(6)3-5(2)7;/h2*3,6H,1-2H3;/q;;+2/p-2/b2*4-3-;
InChI key
QYJPSWYYEKYVEJ-FDGPNNRMSA-L
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应用
- 作为奖励缺陷调节剂的右美沙芬：研究探讨了在MDMA治疗的动物中右美沙芬在调节与5-羟色胺转运体可用性相关的奖励缺陷中的作用，表明其在神经精神药理学和成瘾研究中的潜在应用（Chiu et al., 2024）。
- 靶向GABA谷氨酸神经传递的药物疗法：该综述讨论了右美沙芬在靶向GABA谷氨酸神经传递治疗难治性抑郁症的药物疗法中的用途，强调了其作为NMDA受体拮抗剂和sigma-1受体激动剂的作用（Vecera et al., 2023）。
- 经验依赖性心理效应：一项双盲研究比较了右美沙芬和裸盖菇素对健康志愿者的心理效应，考察了它们经验依赖性和持久性影响，该研究与临床心理学和迷幻药研究相关（Mathai et al., 2023）。
警示用语：
Warning
危险声明
危险分类
Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3
靶器官
Respiratory system
储存分类代码
11 - Combustible Solids
WGK
WGK 3
闪点(°F)
Not applicable
闪点(°C)
Not applicable
个人防护装备
dust mask type N95 (US), Eyeshields, Gloves
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Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
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