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Merck
CN

702668

Sigma-Aldrich

噻吩并[3,2-b]噻吩

95%

别名:

[3,2-b]并二噻吩, 并二噻吩

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About This Item

经验公式(希尔记法):
C6H4S2
CAS号:
分子量:
140.23
MDL编号:
UNSPSC代码:
12352103
PubChem化学物质编号:
NACRES:
NA.23

质量水平

检测方案

95%

形式

solid

mp

53-58 °C

SMILES字符串

c1cc2sccc2s1

InChI

1S/C6H4S2/c1-3-7-6-2-4-8-5(1)6/h1-4H

InChI key

VJYJJHQEVLEOFL-UHFFFAOYSA-N

一般描述

噻吩并(3,2-b)噻吩(TT)是一种富电子共轭聚合物,具有窄带隙的喹啉结构。它有利于形成强大的分子间网络。

应用

TT可用作供体-受体共聚物合成中的共轭侧链。它在增强有机太阳能电池的功率转换效率(PCE)方面具有潜在的应用。

象形图

Exclamation mark

警示用语:

Warning

危险分类

Acute Tox. 4 Oral - Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3

靶器官

Respiratory system

WGK

WGK 3

闪点(°F)

210.0 °F

闪点(°C)

98.9 °C

个人防护装备

dust mask type N95 (US), Eyeshields, Gloves

法规信息

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Synthesis and photovoltaic properties of 2D-conjugated polymers with alkylsilyl-substituted thieno (3, 2-b) thiophene conjugated side chains
Yan T, et al.
Organic Electronics, 57(41), 255-262 (2018)
Andrei Chernyshev et al.
Polymers, 13(3) (2021-01-28)
Four new bis(tpy) unimers with different linkers between the thieno[3,2-b]thiophene-2,5-diyl central unit and terpyridine-4'-yl (tpy) end-groups: no linker (Tt), ethynediyl (TtE), 1,4-phenylene (TtPh) and 2,2'-bithophene-5,5'-diyl (TtB) are prepared, characterized, and assembled with Fe2+ ions to metallo-supramolecular polymers (Fe-MSPs). The Fe-MSP
A fused thieno (3, 2-b) thiophene-dithiophene based donor molecule for organic photovoltaics: a structural comparative study with indacenodithiophene
Abe Y, et al.
Journal of Material Chemistry C, 4(41), 9656-9663 (2016)
A solution-processed high performance organic solar cell using a small molecule with the thieno (3, 2-b) thiophene central unit
Zhang, Q, et al.
Chemical Communications (Cambridge, England), 51(83), 15268-15271 (2015)
Hocheon Yoo et al.
Nature communications, 10(1), 2424-2424 (2019-06-05)
Multilevel metal interconnects are crucial for the development of large-scale organic integrated circuits. In particular, three-dimensional integrated circuits require a large number of vertical interconnects between layers. Here, we present a novel multilevel metal interconnect scheme that involves solvent-free patterning

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