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Merck
CN

654892

Sigma-Aldrich

Aldrich® 负性光致抗蚀剂套装 I

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别名:
Aldrich®负性光致抗蚀剂套装I
UNSPSC代码:
12352300
NACRES:
NA.23

一般描述

Aldrich®负性光致抗蚀剂套装I由用于光蚀刻的材料组成。该光致抗蚀剂可旋涂于玻璃基质上以形成电极阵列。该套装还可用于在玻璃表面上进行掩膜和成像。

应用

Aldrich®负性光致抗蚀剂套装I已被用于通过光刻法制造微电极。它还可用于制造基于液滴的微流控器件、微流控芯片、玻璃光波导和集成光栅耦合器。

法律信息

Aldrich is a registered trademark of Sigma-Aldrich Co. LLC

试剂盒组分也可单独购买

产品编号
说明
化学品安全说明书

  • 651761Negative resist remover I 250 mL化学品安全说明书

  • 651788Negative resist developer I 250 mL化学品安全说明书

  • 651796Negative photoresist I 100 mL化学品安全说明书

  • 651974Negative resist thinner I 100 mL化学品安全说明书

警示用语:

Danger

危险分类

Acute Tox. 4 Dermal - Acute Tox. 4 Inhalation - Acute Tox. 4 Oral - Aquatic Chronic 2 - Asp. Tox. 1 - Carc. 2 - Eye Dam. 1 - Repr. 1B - Skin Corr. 1 - STOT RE 2 Inhalation - STOT SE 3

靶器官

Central nervous system,Liver,Kidney, Respiratory system

WGK

WGK 3

闪点(°F)

Not applicable

闪点(°C)

Not applicable

法规信息

危险化学品

分析证书(COA)

输入产品批号来搜索 分析证书(COA) 。批号可以在产品标签上"批“ (Lot或Batch)字后找到。

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Fabrication and characterization of optical waveguides and grating couplers
J P Sharpe, et al.
European Journal of Physics, 34, 1317-1317 (2013)
High-speed droplet actuation on single-plate electrode arrays
Banerjee AN, et al.
Journal of Colloid and Interface Science, 362(2), 567-574 (2011)
Jie-Bi Hu et al.
The Analyst, 140(5), 1495-1501 (2015-01-28)
Digital microfluidics (DMF) based on the electrowetting-on-dielectric phenomenon is a convenient way of handling microlitre-volume aliquots of solutions prior to analysis. Although it was shown to be compatible with on-line mass spectrometric detection, due to numerous technical obstacles, the implementation
Fabrication and characterization of optical waveguides and grating couplers
Sharpe JP, et al.
European Journal of Physics, 34(5), 1317-1317 (2013)
A compact 3D-printed interface for coupling open digital microchips with Venturi easy ambient sonic-spray ionization mass spectrometry
Hu J, et al.
Analyst, 140(5), 1495-1501 (2015)

实验方案

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

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