所有图片(1)
About This Item
线性分子式:
C7H9RuC7H9
CAS号:
分子量:
287.36
MDL编号:
UNSPSC代码:
12352103
PubChem化学物质编号:
NACRES:
NA.23
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表单
liquid
质量水平
组成
Ru, 33.9-36.4% gravimetric
反应适用性
core: ruthenium
reagent type: catalyst
折射率
n20/D 1.5870 (lit.)
沸点
100 °C/0.01 mmHg (lit.)
mp
6 °C (lit.)
密度
1.3412 g/mL at 25 °C (lit.)
储存温度
−20°C
SMILES字符串
[Ru].CC[C]1[CH][CH][CH][CH]1.CC[C]2[CH][CH][CH][CH]2
InChI
1S/2C7H9.Ru/c2*1-2-7-5-3-4-6-7;/h2*3-6H,2H2,1H3;
InChI key
VLTZUJBHIUUHIK-UHFFFAOYSA-N
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应用
双（乙基环戊二烯基）钌（II）（Ru（EtCp）2），一种金属有机物，可用作Ru薄膜和排列一致的RuO2纳米棒的原子层沉积前体。
警示用语：
Warning
危险声明
危险分类
Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3
靶器官
Respiratory system
储存分类代码
10 - Combustible liquids
WGK
WGK 3
闪点(°F)
>199.9 °F - closed cup
闪点(°C)
> 93.3 °C - closed cup
个人防护装备
Eyeshields, Gloves, type ABEK (EN14387) respirator filter
Growth and characterization of the coexistence of vertically aligned and twinned V-shaped RuO2 nanorods on nanostructural TiO2 template
Chen CA, et al.
J. Alloy Compounds, 485(1-2), 524-528 (2009)
In-situ real-time ellipsometric investigations during the atomic layer deposition of ruthenium: A process development from [(ethylcyclopentadienyl)(pyrrolyl) ruthenium] and molecular oxygen.
Knaut M, et al.
Journal of Vacuum Science & Technology. A, Vacuum, Surfaces, And Films, 30(1), 01A151-01A151 (2012)
ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems.
Waechtler T, et al.
Microelectronic Engineering, 88(5), 684-689 (2011)
Thermal atomic layer deposition (ALD) of Ru films for Cu direct plating.
Choi SH, et al.
Journal of the Electrochemical Society, 158(6), D351-D356 (2011)
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