推荐产品
形式
liquid
质量水平
组成
Ru, 33.9-36.4% gravimetric
反应适用性
core: ruthenium
reagent type: catalyst
折射率
n20/D 1.5870 (lit.)
bp
100 °C/0.01 mmHg (lit.)
mp
6 °C (lit.)
密度
1.3412 g/mL at 25 °C (lit.)
储存温度
−20°C
SMILES字符串
[Ru].CC[C]1[CH][CH][CH][CH]1.CC[C]2[CH][CH][CH][CH]2
InChI
1S/2C7H9.Ru/c2*1-2-7-5-3-4-6-7;/h2*3-6H,2H2,1H3;
InChI key
VLTZUJBHIUUHIK-UHFFFAOYSA-N
正在寻找类似产品? 访问 产品对比指南
应用
双（乙基环戊二烯基）钌（II）（Ru（EtCp）2），一种金属有机物，可用作Ru薄膜和排列一致的RuO2纳米棒的原子层沉积前体。
警示用语：
Warning
危险声明
危险分类
Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3
靶器官
Respiratory system
WGK
WGK 3
闪点(°F)
>199.9 °F
闪点(°C)
> 93.3 °C
个人防护装备
Eyeshields, Gloves, type ABEK (EN14387) respirator filter
Thermal atomic layer deposition (ALD) of Ru films for Cu direct plating.
Choi SH, et al.
Journal of the Electrochemical Society, 158(6), D351-D356 (2011)
In-situ real-time ellipsometric investigations during the atomic layer deposition of ruthenium: A process development from [(ethylcyclopentadienyl)(pyrrolyl) ruthenium] and molecular oxygen.
Knaut M, et al.
Journal of Vacuum Science & Technology. A, Vacuum, Surfaces, And Films, 30(1), 01A151-01A151 (2012)
Growth and characterization of the coexistence of vertically aligned and twinned V-shaped RuO2 nanorods on nanostructural TiO2 template
Chen CA, et al.
J. Alloy Compounds, 485(1-2), 524-528 (2009)
ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems.
Waechtler T, et al.
Microelectronic Engineering, 88(5), 684-689 (2011)
我们的科学家团队拥有各种研究领域经验，包括生命科学、材料科学、化学合成、色谱、分析及许多其他领域.
联系技术服务部门