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Merck
CN

403342

Sigma-Aldrich

乙酸亚铜

97%

别名:

乙酸亚铜, 单醋酸铜

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About This Item

线性分子式:
CuCO2CH3
CAS号:
分子量:
122.59
EC 号:
MDL编号:
UNSPSC代码:
12352103
PubChem化学物质编号:
NACRES:
NA.23

质量水平

方案

97%

表单

powder and chunks

反应适用性

core: copper
reagent type: catalyst

mp

250 °C (dec.) (lit.)

SMILES字符串

CC(=O)O[Cu]

InChI

1S/C2H4O2.Cu/c1-2(3)4;/h1H3,(H,3,4);/q;+1/p-1

InChI key

RFKZUAOAYVHBOY-UHFFFAOYSA-M

相关类别

应用

乙酸铜(CuOAc)曾用作制备铜纳米粒子和CuAlO2 p型纳米结构半导体的起始物料。

储存分类代码

11 - Combustible Solids

WGK

WGK 3

闪点(°F)

Not applicable

闪点(°C)

Not applicable

个人防护装备

dust mask type N95 (US), Eyeshields, Gloves


历史批次信息供参考:

分析证书(COA)

Lot/Batch Number

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Jan Lorkowski et al.
Chemistry (Weinheim an der Bergstrasse, Germany), 25(48), 11365-11374 (2019-07-06)
Cyclic (amino)(aryl)carbenes (cAArCs) based on the isoindoline core were successfully generated in situ by α-elimination of 3-alkoxyisoindolines at high temperatures or by deprotonation of isoindol-2-ium chlorides with sodium or copper(I) acetates at low temperatures. 3-Alkoxy-isoindolines 2 a,b-OR (R=Me, Et, iPr) have
Room?Temperature Formation of Hollow Cu2O Nanoparticles.
Hung LI, et al.
Advanced Materials, 22.17, 1910-1914 (2010)
Synthesis of delafossite CuAlO 2 p-type semiconductor with a nanoparticle-based Cu (I) acetate-loaded boehmite precursor
Thu TV, et al.
Mat. Res. Bul., 46.11, 1819-1827 (2011)
Thomas G Meikle et al.
ACS applied materials & interfaces, 12(6), 6944-6954 (2020-01-10)
Herein, we demonstrate a method for the functionalization of cubic phase lipid nanoparticles (cubosomes) with a series of magnetite (Fe3O4), copper oxide (Cu2O), and silver (Ag) nanocrystals, with prospective applications across a wide range of fields, including antimicrobial treatments. The
You Zhai et al.
Chemphyschem : a European journal of chemical physics and physical chemistry, 17(5), 741-751 (2015-11-04)
Cu2 S/ZnS heterostructured nanorods (HNRs) with uncommon morphologies are achieved through single-pot and multi-batch synthetic strategies. In both cases, Cu2 S NRs form first, which then undergo partial cation exchange and solution-liquid-solid (SLS)-like growth catalyzed by the remaining Cu2 S

商品

Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.

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