推荐产品
产品名称
聚环氧乙烷, average Mv ~1,000,000 (nominal), powder
表单
powder
质量水平
分子量
average Mv ~1,000,000 (nominal)
包含
200-500 ppm BHT as inhibitor
粘度
400-800 cP, 2 % in H2O(25 °C, Brookfield)(lit.)
官能团
hydroxyl
SMILES字符串
[H]OCCO
InChI
1S/C2H6O2/c3-1-2-4/h3-4H,1-2H2
InChI key
LYCAIKOWRPUZTN-UHFFFAOYSA-N
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一般描述
聚环氧乙烷(PEO)是一种市面上可售的晶体状、热塑性且可溶于水的聚合物。
应用
PEO（Mv - 1,000,000，粉末）可用于中空TiO2纤维的制备，适用于药物输送、催化剂、传感器和电子器件等各种应用。此外，还可用作形成染料敏化太阳能电池(DSSC)的电解质。
储存分类代码
11 - Combustible Solids
WGK
WGK 1
闪点(°F)
Not applicable
闪点(°C)
Not applicable
历史批次信息供参考:
分析证书(COA)
Lot/Batch Number
Solid-state dye-sensitized hierarchically structured ZnO solar cells
Deng J, et al.
Electrochimica Acta, 56(11), 4176-4180 (2011)
Fabrication of hollow TiO2 fibers templated by electrospun aqueous poly (ethylene oxide)(PEO) solution
Nagamine S, et al.
Chemistry Letters (Jpn), 38(3), 258-259 (2009)
Yi Huang et al.
Polymers, 12(5) (2020-05-21)
Controlling the rheological property of suspensions consisting of colloidal particles and polymers is necessary in industry. Especially, gels induced by shear (shake-gel) are interesting phenomena in rheological field. To gain insight into the shake-gel phenomena of the aqueous suspensions of
Ievgenii Liashenko et al.
Nature communications, 11(1), 753-753 (2020-02-08)
Additive manufacturing technologies based on layer-by-layer deposition of material ejected from a nozzle provide unmatched versatility but are limited in terms of printing speed and resolution. Electrohydrodynamic jetting uniquely allows generating submicrometer jets that can reach speeds above 1 m s-1, but
M Patel Geeta et al.
Current drug delivery, 6(2), 159-165 (2009-05-20)
Carbamazepine indicated for the control of epilepsy, undergoes extensive hepatic first-pass metabolism after oral administration. A vaginal dosage form of carbamazepine is not commercially available. Conventional suppository having poor retention in the vaginal tract, as they are removed in a
商品
Electrospinning technique applications discussed, emphasizing control of nanofibers and assembly into 3D architectures.
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