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Merck
CN

229601

Sigma-Aldrich

乙酸铜 一水合物

greener alternative

99.99% trace metals basis

别名:

醋酸铜 一水合物

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About This Item

线性分子式:
Cu(CO2CH3)2 · H2O
CAS号:
分子量:
199.65
Beilstein:
3730548
EC 号:
MDL编号:
UNSPSC代码:
12352103
PubChem化学物质编号:
NACRES:
NA.23

蒸汽密度

6.8 (vs air)

质量水平

方案

99.99% trace metals basis

表单

powder or crystals

反应适用性

core: copper

环保替代产品特性

Catalysis
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sustainability

Greener Alternative Product

环保替代产品分类

SMILES字符串

O.CC(=O)O[Cu]OC(C)=O

InChI

1S/2C2H4O2.Cu.H2O/c2*1-2(3)4;;/h2*1H3,(H,3,4);;1H2/q;;+2;/p-2

InChI key

NWFNSTOSIVLCJA-UHFFFAOYSA-L

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一般描述

乙酸铜(II)一水合物可溶于水,微溶于甲醇、二乙醚和丙酮。它可以通过乙酸与碳酸铜(II)或氢氧化铜(II)或氧化铜(II)反应进行合成。通过将铜金属放置在空气和回流乙酸环境中,可以大规模商业生产乙酸铜(II)。作为过渡金属乙酸盐,它可以通过声化学方法形成氧化物纳米颗粒。
我们致力于为您提供更环保的替代产品,以符合“绿色化学的 12 项原则”的一项或多项原则要求。该产品具有增强催化作用。点击此处以获取更多信息。

应用

用于合成氧化铜纳米颗粒,Cu2ZnSnS4 薄膜,它可用于太阳能电池。 它可用于氧化锌压敏电阻,作为有机材料聚合的催化剂以及纺织品染色的媒染剂。工业上,它可以用作陶瓷颜料和杀真菌剂。

警示用语:

Danger

危险声明

危险分类

Acute Tox. 4 Oral - Aquatic Acute 1 - Aquatic Chronic 2 - Eye Dam. 1 - Skin Corr. 1B

储存分类代码

8B - Non-combustible corrosive hazardous materials

WGK

WGK 3

闪点(°F)

does not flash

闪点(°C)

does not flash

个人防护装备

dust mask type N95 (US), Eyeshields, Gloves


历史批次信息供参考:

分析证书(COA)

Lot/Batch Number

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Cu2ZnSnS4 films deposited by a soft-chemistry method.
Todorov T, et al.
Thin Solid Films, 517(7), 2541-2544 (2009)
Sonochemical synthesis and characterization of nanometer-size transition metal oxides from metal acetates.
Kumar RV, et al.
Chemistry of Materials, 12(8), 2301-2305 (2000)
Alexander Navarrete et al.
Faraday discussions, 183, 249-259 (2015-09-24)
A novel plasmonic reactor concept is proposed and tested to work as a visible energy harvesting device while allowing reactions to transform CO2 to be carried out. Particularly the reverse water gas shift (RWGS) reaction has been tested as a
Monica L Ohnsorg et al.
Langmuir : the ACS journal of surfaces and colloids, 31(22), 6114-6121 (2015-05-29)
Thin films can integrate the versatility and great potential found in the emerging field of metal-organic frameworks directly into device architectures. For fabrication of smart interfaces containing surface-anchored metal-organic frameworks, it is important to understand how the foundational layers form
Łukasz Orzeł et al.
Dalton transactions (Cambridge, England : 2003), 44(13), 6012-6022 (2015-02-28)
The nature of chlorophyll interactions with copper(II) ions varies considerably in organic solvents, depending on the dominant coordinative form. Besides formation of the metallo tetrapyrrolic complex, Cu(II) ions can cause oxidation of the pigment, reversible or irreversible, which can lead

商品

Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.

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