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Merck
CN

Moving pulsed dielectrophoresis.

Lab on a chip (2013-02-23)
Thibault Honegger, David Peyrade
摘要

In this paper, we introduce a dielectrophoresis (DEP)-based handling method that allows fine 3D manipulation of beads in suspension using a lab on a chip device. The device consists of two layers of linear electrodes on the top and bottom of a microfluidic channel. Each electrode layer has a 53 × 53 donut trap matrix, with traps that are linearly connected into rows along the top, and columns along the bottom of the channel. To address in this matrix a single particle in suspension, we introduce pulsed dielectrophoresis (puDEP) where the AC signal used to induce dielectrophoresis is chopped, such that only beads that are at the intersection of two perpendicular electrodes are constantly polarized. Finally, by combining puDEP and moving dielectrophoresis (mDEP), we introduce a generic application of dielectrophoresis namely moving pulsed dielectrophoresis (mpuDEP) that allows the contactless, micron accuracy, addressable displacement in a 2D array of a single bead in suspension.

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聚乙烯, low density, melt index 25 g/10 min (190°C/2.16kg)
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聚乙烯, average Mw ~4,000 by GPC, average Mn ~1,700 by GPC
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聚乙烯, Ultra-high molecular weight, surface-modified, powder, 34-50 μm particle size
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聚乙烯, High density, melt index 12 g/10 min (190 °C/2.16kg)
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聚乙烯, Ultra-high molecular weight, average Mw 3,000,000-6,000,000
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聚乙烯, Linear low density, melt index 1.0 g/10 min (190°C/2.16kg)
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聚乙烯, Medium density
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聚乙烯, High density, melt index 2.2 g/10 min (190 °C/2.16kg)
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聚乙烯, Ultra-high molecular weight, surface-modified, powder, 125 μm avg. part. size
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聚乙烯, analytical standard, for GPC, 2,000