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Merck
CN

95372

Sigma-Aldrich

granular, ≥99.99% trace metals basis

别名:

Bi

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About This Item

经验公式(希尔记法):
Bi
CAS号:
分子量:
208.98
EC 号:
MDL编号:
UNSPSC代码:
12161600
PubChem化学物质编号:
NACRES:
NA.22

蒸汽压

<0.1 mmHg ( 20 °C)

质量水平

方案

≥99.99% trace metals basis

表单

granular

反应适用性

core: bismuth
reagent type: catalyst

电阻率

129 μΩ-cm, 20°C

沸点

1560 °C (lit.)

mp

271 °C (lit.)
272 °C

密度

9.8 g/mL at 25 °C (lit.)

SMILES字符串

[Bi]

InChI

1S/Bi

InChI key

JCXGWMGPZLAOME-UHFFFAOYSA-N

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一般描述

Bismuth is a silvery, very brittle metal with a high metallic luster. In the periodic table, it is next to lead. Bismuth has a variety of applications, including medicine, materials synthesis, organic synthesis, and catalysis . It is used in the production of malleable iron and as a catalyst in the manufacture of acrylic fibers . Additionally, bismuth promotes noble metal-based catalysts for the selective oxidation of alcohols, aldehydes and carbohydrates with molecular oxygen in liquid phases.

应用

Bismuth granules are used in the preparation of bismuth nanoparticles by solution dispersion method. It is a precursor to synthesize bismuth-silicate glasses.
Bismuth is used as a precursor in the synthesis of Cu3BiS3 based solar device.

储存分类代码

11 - Combustible Solids

WGK

nwg

闪点(°F)

Not applicable

闪点(°C)

Not applicable

个人防护装备

Eyeshields, Gloves, type N95 (US)

法规信息

新产品

历史批次信息供参考:

分析证书(COA)

Lot/Batch Number

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访问文档库

The elements
Hammond CR
CRC Handbook of Chemistry and Physics, 81 (2000)
Bismuth and bismuth alloys
Chagnon MJ
Kirk-Othmer Encyclopedia of Chemical Technology (2000)
A simple way to prepare bismuth nanoparticles.
Zhao Y, et al.
Materials Letters, 58(5), 790-793 (2004)
Thin film photovoltaic devices prepared with Cu3BiS3 ternary compound
Hernadez-Mota J, et al.
Materials Science in Semiconductor Processing, 87, 37-43 (2018)
Modification of carbon screen-printed electrodes by adsorption of chemically synthesized Bi nanoparticles for the voltammetric stripping detection of Zn (II), Cd (II) and Pb (II).
Rico MAG, et al.
Talanta, 80(2), 631-635 (2009)

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