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表单
liquid
包含
1.25 g/L±0.125 g/L stabilizer
0.015 g/L±0.0015 g/L wetting agent
4.25 g/L±0.25 g/L Stress reducer
组成
30 g/L ±0.5 g/L H3BO3
170g/L ±5 g/L Ni(SO3NH2)2.4H2O
9.51 g/L ±1 g/L NiBr2 .xH2O
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一般描述
Nickel electroplating solution is designed for the fabrication of low stress, smooth and pinhole-free nickel films.
特点和优势
- Deposits have low internal stress and are very ductile.
- Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity.
- As plated Ni films have small grains in the range of 10 - 50 nm. Grain size orientations are (111) and (200) for FCC (face centred cubic).
- Qualified bath metrology for replenishment and a long shelf life.
Electroplated Ni film (5-10 μm thickness) properties:
- Density: 8.1 g/cm3
- Young′s modulus: 210 GPa
- Internal stress 33 ± 13 MPa
- Tensile strength: 585 ± 40 MPa
- Grain size: 10-50 nm
警示用语：
Danger
危险分类
Aquatic Chronic 2 - Carc. 1A Inhalation - Eye Dam. 1 - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Sens. 1 - STOT RE 1 - STOT RE 2 Inhalation
靶器官
Respiratory Tract
WGK
WGK 3
闪点(°F)
Not applicable
闪点(°C)
Not applicable
法规信息
危险化学品
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