形式
liquid
颜色
green
最佳pH
3.2
一般描述
An electroless nickel plating process designed for electroless nickel plating on copper, brass and copper alloy
CLEANING PROCEDURE FOR COPPER SAMPLES:
1. Clean copper with some physical abrasion.
2. Dip for one minute in alkaline cleaner at 65°C (150°F).
3. Rinse with deionized water.
4. Dip for one minute in 30% HCl
5. Rinse with deionized water.
PLATING BATH - USE AND CONTROL
Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (electroless nickel plating solution, ammonia free). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.
CLEANING PROCEDURE FOR COPPER SAMPLES:
1. Clean copper with some physical abrasion.
2. Dip for one minute in alkaline cleaner at 65°C (150°F).
3. Rinse with deionized water.
4. Dip for one minute in 30% HCl
5. Rinse with deionized water.
PLATING BATH - USE AND CONTROL
Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (electroless nickel plating solution, ammonia free). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.
警示用语：
Danger
危险分类
Acute Tox. 4 Inhalation - Acute Tox. 4 Oral - Aquatic Chronic 2 - Carc. 1A Inhalation - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Irrit. 2 - Skin Sens. 1 - STOT RE 1
靶器官
Lungs
WGK
WGK 3
闪点(°F)
230.7 °F
闪点(°C)
110.4 °C
法规信息
新产品
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