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蒸汽压
<0.01 mmHg ( 537.2 °C)
方案
99.95% trace metals basis
表单
foil
自燃温度
572 °F
反应适用性
core: tantalum
电阻率
13.5 μΩ-cm, 20°C
直径× 厚度
2.00 in. × 0.25 in.
沸点
5425 °C (lit.)
mp
2996 °C (lit.)
密度
16.69 g/cm3 (lit.)
SMILES字符串
[Ta]
InChI
1S/Ta
InChI key
GUVRBAGPIYLISA-UHFFFAOYSA-N
应用
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
储存分类代码
11 - Combustible Solids
WGK
nwg
闪点(°F)
Not applicable
闪点(°C)
Not applicable
Kostantinidis; S.;
The European Physical Journal - Applied Physics, 56(2), 24002/1-24002/1 (2011)
Helmersson; U.;
Thin Solid Films, 513(1-2), 1-1 (2006)
Robert Cohen
American journal of orthopedics (Belle Mead, N.J.), 31(4), 216-217 (2002-05-15)
Conventional materials used for orthopedic reconstruction implants limit the design of new and improved implants. Solid metal is rigid. Porous fixation surfaces have low volumetric porosity available for biologic ingrowth and low frictional characteristics for initial implant stability and have
Brett Levine et al.
The journal of knee surgery, 20(3), 185-194 (2007-08-02)
Porous tantalum represents an alternative metal for primary and revision total knee arthroplasty (TKA) with several unique properties. Tantalum is a transition metal, which in its bulk form has shown excellent biocompatibility and is safe to use in vivo as
Nilesh Patil et al.
Journal of biomedical materials research. Part B, Applied biomaterials, 89(1), 242-251 (2008-10-08)
Conventional porous-coated joint prostheses used in hip and knee reconstruction have demonstrated good clinical results, however, these implants possess some inherent shortcomings such as low volumetric porosity, suboptimal frictional characteristics, and higher modulus of elasticity relative to that of bone.
商品
Nanocomposite Coatings with Tunable Properties Prepared by Atomic Layer Deposition
Spintronics offer breakthroughs over conventional memory/logic devices with lower power, leakage, saturation, and complexity.
The properties of many devices are limited by the intrinsic properties of the materials that compose them.
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