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蒸汽压
1 mmHg ( 487 °C)
检测方案
99.995% trace metals basis
形式
solid
电阻率
5.8 μΩ-cm, 20°C
直径× 厚度
3.00 in. × 0.125 in.
bp
907 °C (lit.)
mp
420 °C (lit.)
密度
7.133 g/mL at 25 °C (lit.)
SMILES字符串
[Zn]
InChI
1S/Zn
InChI key
HCHKCACWOHOZIP-UHFFFAOYSA-N
应用
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.
WGK
WGK 3
法规信息
新产品
Oechsner, H.
Applied Physics. A, Materials Science & Processing, 8, 185-185 (1975)
Dahn, J. R.; Trussler, S.; Hatchard, T. D.; Bonakdarpour, B. et al.
Chemistry of Materials, 14, 3519-3519 (2002)
Hahn, H.; Averback, R. S.
Journal of Applied Physics, 67, 1113-1113 (1990)
Sigmund, P.
Physical Review, 184, 383-383 (1969)
Sara Eyal et al.
Journal of nuclear medicine : official publication, Society of Nuclear Medicine, 50(5), 798-806 (2009-05-01)
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