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Merck
CN
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安全信息

667501

Sigma-Aldrich

氮化钽蚀刻剂

别名:

氮化钽腐蚀剂

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About This Item

MDL编号:
UNSPSC代码:
12161700
NACRES:
NA.23

一般描述

Tantalum nitride etchant is a high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications.

应用

在电子应用中可作为精确清洁地蚀刻钽、氮化钽和氧化钽薄膜和防蚀涂层的蚀刻溶液。

特点和优势

25°C 时腐蚀速度为 70-80Å/秒。与金正性或负性光致抗蚀剂共同使用。用去离子水冲洗。

制备说明

  • Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity.
  • Dilute with water or lower the temperature to achieve a lower etch rate. Adding 1 part water to 2 parts etchant or reducing the temperature 10 °C will approximately reduce the etch rate by 50%.
  • Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation.
  • Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.
  • Gold would be the ideal etch stop. You might also succeed with tungsten
  • Rinse with Deionized water.

象形图

Skull and crossbonesCorrosion

警示用语:

Danger

危险分类

Acute Tox. 1 Dermal - Acute Tox. 2 Oral - Acute Tox. 3 Inhalation - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A

补充剂危害

储存分类代码

6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials

WGK

WGK 2

闪点(°F)

Not applicable

闪点(°C)

Not applicable

个人防护装备

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter

法规信息

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分析证书(COA)

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