643262
镀金硅片
99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)
别名:
gold coated silicon, gold coated wafer
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关于此项目
线性分子式:
Au
分子量:
196.97
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12352103
MDL number:
产品名称
镀金硅片, 99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)
InChI
1S/Au
SMILES string
[Au]
InChI key
PCHJSUWPFVWCPO-UHFFFAOYSA-N
assay
99.99% (Ti)
99.999% (Au)
diam. × thickness
4 in. × 500 μm
layer thickness
1000 Å
matrix attachment
Titanium, as adhesion layer used to bind the gold to the silicon wafer.
Quality Level
General description
钛粘附层，用于将金粘合到硅片 (100) 上。金取向名义上为具有 <111> 取向的高度多晶的。
Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.
Application
Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.
Packaging
Packaging 1 set in single wafer shipper
存储类别
11 - Combustible Solids
wgk
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
法规信息
新产品
此项目有
Aguilar, M. et al.
Surface Science, 482-485, 935-935 (2001)
商品
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