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蒸汽密度
1 (vs air)
质量水平
方案
98%
表单
liquid
折射率
n20/D 1.396 (lit.)
沸点
175-176 °C (lit.)
mp
17-18 °C (lit.)
密度
0.956 g/mL at 25 °C (lit.)
SMILES字符串
C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1
InChI
1S/C8H24O4Si4/c1-13(2)9-14(3,4)11-16(7,8)12-15(5,6)10-13/h1-8H3
InChI key
HMMGMWAXVFQUOA-UHFFFAOYSA-N
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一般描述
八甲基环四硅氧烷（D4）是一种分子量相对较低的挥发性甲基硅氧烷（VMS）。该硅酮流体具有环状排列的硅-氧键，并且其中甲基连接至硅原子上。D4可用于制造用于医疗设备和个人护理产品的有机硅基聚合物。
应用
以稀土固体超强酸为催化剂，D4可通过开环聚合，用于乙烯基包覆聚二甲基硅氧烷（PDMS）的合成。它也可以用作核磁共振低温法（NMRC）的探测液，以分析含油致密砂岩的孔径分布（PSD）。D4的化学气相沉积（CVD）可用于制备基于硅氧烷的薄膜。
警示用语：
Warning
危险声明
危险分类
Aquatic Acute 1 - Aquatic Chronic 1 - Flam. Liq. 3 - Repr. 2
储存分类代码
3 - Flammable liquids
WGK
WGK 3
闪点(°F)
123.8 °F - closed cup
闪点(°C)
51 °C - closed cup
个人防护装备
Eyeshields, Gloves, type ABEK (EN14387) respirator filter
法规信息
危险化学品
Photocatalytic oxidation of octamethylcyclotetrasiloxane (D4): Towards a better understanding of the impact of volatile methyl siloxanes on photocatalytic systems.
Lamaa L, et al.
Applied Catalysis. B, Environmental, 156, 438-446 (2014)
Applying octamethylcyclotetrasiloxane as a probe liquid for characterizing the pore size distribution of oil-bearing tight sandstones by nuclear magnetic resonance cryoporometry.
Liu Biao, et al.
Marine and Petroleum Geology, 88(2), 814-825 (2017)
Stephanie Watermann et al.
Metabolites, 11(1) (2021-01-13)
1H NMR spectroscopy, in combination with chemometric methods, was used to analyze the methanol/acetonitrile (1:1) extract of walnut (Juglans Regia L.) regarding the geographical origin of 128 authentic samples from different countries (France, Germany, China) and harvest years (2016-2019). Due
Hot-filament chemical vapor deposition of organosilicon thin films from hexamethylcyclotrisiloxane and octamethylcyclotetrasiloxane.
Lewis HGP
Journal of the Electrochemical Society, 148(12), F212-F220 (2001)
Synthesis of vinyl end-capped polydimethylsiloxane by ring opening polymerization of octamethylcyclotetrasiloxane (D4) catalyzed by rare earth solid super acid SO42-/TiO2/Ln3+.
Yang X, et al.
Polymer International, 63(2), 347-351 (2014)
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Self-healing soft electronic materials enable autonomous repair, reducing waste and costs in electronic devices.
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