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Sigma-Aldrich

Molybdenum(IV) sulfide

powder

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Synonym(s):
Molybdenum disulfide
Empirical Formula (Hill Notation):
MoS2
CAS Number:
1317-33-5
Molecular Weight:
160.07
EC Number:
215-263-9
MDL number:
MFCD00003470
UNSPSC Code:
12352300
PubChem Substance ID:
57652216
NACRES:
NA.23

form

powder

particle size

~6 μm (max. 40 μm)

density

5.06 g/mL at 25 °C (lit.)

SMILES string

S=[Mo]=S

InChI

1S/Mo.2S

InChI key

CWQXQMHSOZUFJS-UHFFFAOYSA-N

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General description

Molybdenum disulfide is a two dimensional layered material. Monolayers of transition metal dichalcogenides (TMDs)exhibit photoconductivity. The layers of the TMD can be mechanically or chemicaly exfoliated to form nanosheets.

Application

Acidic solution of MoS2 particles was used to catalyze hydrogen evolution at a water 1,2-dichloroethane interface. MoS2 was dispersed in N-methyl-pyrrolidone to form exfoliated MoS2 flakes of various sizes. MoS2 ink was used for inkjet printer. MoS2 may find potential applications in electronics and optoelectronics.

WGK

nwg

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

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Preparation of high concentration dispersions of exfoliated MoS2 with increased flake size
O?Neill A, et al.
Chemistry of Materials, 24(12), 2414- 2421 (2012)
"Inkjet Printing of MoS2
Li J, et al.
Advances in Functional Materials, 24(41), 6524-6531 (2014)
Photoconductivity of solution-processed MoS 2 films.
Cunningham G, et al.
Journal of Material Chemistry C, 1(41), 6899-6904 (2013)
Dattatray J Late et al.
ACS nano, 6(6), 5635-5641 (2012-05-15)
Field effect transistors using ultrathin molybdenum disulfide (MoS(2)) have recently been experimentally demonstrated, which show promising potential for advanced electronics. However, large variations like hysteresis, presumably due to extrinsic/environmental effects, are often observed in MoS(2) devices measured under ambient environment.
Branimir Radisavljevic et al.
ACS nano, 5(12), 9934-9938 (2011-11-15)
Logic circuits and the ability to amplify electrical signals form the functional backbone of electronics along with the possibility to integrate multiple elements on the same chip. The miniaturization of electronic circuits is expected to reach fundamental limits in the
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