GF77686521
Polyimide
(PI), film, thickness 0.025 mm, L 5 m, grade kapton hn
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Synonym(s):
IM301200
UNSPSC Code:
12352100
NACRES:
NA.23
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form
film
manufacturer/tradename
Goodfellow 776-865-21
L
5 m
thickness
0.025 mm
General description
Polyimides are an important class of high-temperature engineering polymers consist of aromatic dianhydrides and diamine monomers. These polymers are well known for their high-temperature stability, low-temperature tolerance, mechanical strength, chemical resistance, radiation resistance, and excellent dielectric properties.
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Application
Polyimide films (thickness 0.025 mm) can be used in capacitors, flexible printing circuits boards, insulation materials, and also in optoelectronic applications, such as transparent conductive film, transparent substrates for flexible display, and flexible solar cells. It is also used for the fabrication of flexible copper-clad laminates (FCCLs) for advanced microelectronic assembly.
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Product of Goodfellow
WGK
WGK 3
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Regulatory Information
新产品
Certificates of Analysis (COA)
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Polyimides
F.I.L./I.D.F., Milchwiss. (2017)
A review on colorless and optically transparent polyimide films: Chemistry, process and engineering applications
Ni Hong-jiang, et al.
Journal of Industrial and Engineering Chemistry, 28, 16-27 (2015)
Study on charge transport mechanism and space charge characteristics of polyimide films
Zhou LR, et al.
IEEE Transactions on Dielectrics and Electrical Insulation, 16(4), 1143-1149 (2009)
A study of the composite insulation breakdown properties for wrapping cables in liquid nitrogen
Wei Bin, et al.
IEEE Transactions on Applied Superconductivity, 25(1), 1-6 (2014)
Preparation and properties of heat-sealable polyimide films with comparable coefficient of thermal expansion and good adhesion to copper matrix.
Zhang XM, et al.
Express Polymer Letters, 11(12) (2017)
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