D213705
Diphenylsilanediol
95%
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About This Item
Linear Formula:
(C6H5)2Si(OH)2
CAS Number:
Molecular Weight:
216.31
UNSPSC Code:
12352103
NACRES:
NA.23
PubChem Substance ID:
EC Number:
213-427-4
Beilstein/REAXYS Number:
2523445
MDL number:
InChI key
OLLFKUHHDPMQFR-UHFFFAOYSA-N
InChI
1S/C12H12O2Si/c13-15(14,11-7-3-1-4-8-11)12-9-5-2-6-10-12/h1-10,13-14H
SMILES string
O[Si](O)(c1ccccc1)c2ccccc2
vapor density
>1 (vs air)
assay
95%
form
powder
General description
Diphenylsilanediol(DPSD) is an alkoxysilane that is used as a silane based precusor in the synthesis of organosiloxane based resins.
Application
DPSD may be used as a precursor in the synthesis of linear vinyl oligosiloxane resins which can be potentially used in the fabrication of thermally resistant light emitting diode(LED) encapsulant. Mercaptopropyl-phenyl-oligosiloxane and phenyl-vinyl-oligosiloxane may be synthesized by using DPSD which can further be used as a thiolene derived dielectric layer for organic thin film transistors.
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High color rendering white light-emitting diodes based on a green silicate phosphor mixed with a red dye-bridged hybrid.
Kwak S, et al.
Royal Society of Chemistry Advances, 2(32), 12371-12377 (2012)
Thiol-Ene Reaction Derived Sol-Gel Hybrid Dielectric Layer for Oragnic Thin Film Transistors.
Kim J, et al.
ECS Transactions, 50(4), 83-88 (2013)
Hyeon-Gyun Im et al.
ACS applied materials & interfaces, 12(50), 56462-56469 (2020-12-02)
Metal nanowires (NWs) are promising transparent conducting electrode (TCE) materials because of their excellent optoelectrical performance, intrinsic mechanical flexibility, and large-scale processability. However, the surface roughness, thermal/chemical instability, and limited electrical conductivity associated with empty spaces between metal NWs are
Stereochemical basis of anticonvulsant drug action. Crystal and molecular structure of diphenylsilanediol.
Fawcett JK, et al.
Chemistry (Weinheim An Der Bergstrasse, Germany), 55(20), 3631-3635 (1977)
Sol-gel synthesized linear oligosiloxane-based hybrid material for a thermally-resistant light emitting diode (LED) encapsulant.
Bae J, et al.
Royal Society of Chemistry Advances, 3(23), 8871-8877 (2013)
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