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description
Cu(0) in Cu nanoparticles: >95%
form
liquid
composition
Triethylene glycol monomethyl ether (solvent, TGME)
particle size distribution
120 nm (D90 (by Lumisizer™))
50 nm (D50)
surface tension
34 dyn/cm (Pendant Drop)
viscosity
32 cP (Brookfield, Cone Spindle 40, 25ºC)
density
1.85 g/mL
cation traces
Cu: 50 wt. %
storage temp.
15-25°C
Application
- Compatible printheads
- Product fit for:
Printed Electronics:
FPD, RFID, PCB
Caution
Handle under Ar.
Physical properties
- Sintering conditions (on glass) :
Resistivity after laser sintering : ≤5 μOhm·cm (≤3 bulk)
Thermal 300 Celsius/30 min (under Argon) : ≤120 μOhm.cm (≤70 bulk)
- Adhesion to (tested) :
Adhesion depends on substrate, sintering conditions, substrate, pretreatment and pattern thickness (tested according to ASTM-3359-09 or ISO-2409). Substrates listed here were tested and perform well. Other substrates may also be applicable
- Compatible printheads:
Printheads listed here were tested and perform well. Other printheads may also be applicable
Storage and Stability
Legal Information
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Aquatic Acute 1 - Aquatic Chronic 1 - Self-heat. 1
Storage Class Code
4.2 - Pyrophoric and self-heating hazardous materials
WGK
WGK 2
Flash Point(F)
>230.0 °F
Flash Point(C)
> 110 °C
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