901630
Electroless nickel plating strike
Synonym(s):
Electroless nickel plating solution for copper, brass and copper alloys
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About This Item
UNSPSC Code:
12352303
NACRES:
NA.23
form
liquid
color
green
optimum pH
3.2
General description
An electroless nickel plating process designed for electroless nickel plating on copper, brass and copper alloy
CLEANING PROCEDURE FOR COPPER SAMPLES:
1. Clean copper with some physical abrasion.
2. Dip for one minute in alkaline cleaner at 65°C (150°F).
3. Rinse with deionized water.
4. Dip for one minute in 30% HCl
5. Rinse with deionized water.
PLATING BATH - USE AND CONTROL
Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (electroless nickel plating solution, ammonia free). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.
CLEANING PROCEDURE FOR COPPER SAMPLES:
1. Clean copper with some physical abrasion.
2. Dip for one minute in alkaline cleaner at 65°C (150°F).
3. Rinse with deionized water.
4. Dip for one minute in 30% HCl
5. Rinse with deionized water.
PLATING BATH - USE AND CONTROL
Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (electroless nickel plating solution, ammonia free). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Acute Tox. 4 Inhalation - Acute Tox. 4 Oral - Aquatic Chronic 2 - Carc. 1A Inhalation - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Irrit. 2 - Skin Sens. 1 - STOT RE 1
Target Organs
Lungs
WGK
WGK 3
Flash Point(F)
230.7 °F
Flash Point(C)
110.4 °C
Regulatory Information
新产品
Certificates of Analysis (COA)
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