667471
Anisotropic Silicon <100> Etchant
Synonym(s):
Preferential Silicon Etchant, Silicon 100 Etch, Silicon Preferential Etch
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About This Item
Recommended Products
refractive index
n20/D 1.484
bp
>240 °C
density
1.001 g/mL at 25 °C
General description
Ethylenediamine based - for < 100 > crystal orientation
Application
Etch rate ~80microns/hour at @ 100 °C. Etches cleanly with only a deionized water rinse needed. Will not etch Au or Ta.
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Acute Tox. 3 Dermal - Acute Tox. 4 Oral - Aquatic Chronic 3 - Carc. 1B - Eye Dam. 1 - Flam. Liq. 3 - Muta. 2 - Resp. Sens. 1 - Skin Corr. 1B - Skin Sens. 1
Storage Class Code
3 - Flammable liquids
WGK
WGK 3
Flash Point(F)
109.9 °F
Flash Point(C)
43.3 °C
Personal Protective Equipment
dust mask type N95 (US), Eyeshields, Gloves
Regulatory Information
危险化学品
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