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vapor pressure
14 mmHg ( 20 °C)
bp
200 °C
mp
−35 °C
Application
Designed for etching evaporated films commonly employed as bonding and barrier layers in microelectronics. Excellent resolution, photo resist compatibility, and minimal undercutting are readily achieved.
Features and Benefits
Use with Polyethylene tanks between 20°-50°C.
Etch Rates
25Å/sec @ 20°C,
50Å/sec @ 30°C.
Rinse with DI water
Etch Rates
25Å/sec @ 20°C,
50Å/sec @ 30°C.
Rinse with DI water
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Acute Tox. 1 Dermal - Acute Tox. 2 Oral - Acute Tox. 3 Inhalation - Eye Dam. 1 - Skin Corr. 1A
Storage Class Code
6.1A - Combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
WGK
WGK 2
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Personal Protective Equipment
dust mask type N95 (US), Eyeshields, Gloves
Regulatory Information
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