667463
Titanium etchant
Synonym(s):
Titanium etch
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About This Item
UNSPSC Code:
12352300
MDL number:
vapor pressure
14 mmHg ( 20 °C)
bp
200 °C
mp
−35 °C
Application
Designed for etching evaporated films commonly employed as bonding and barrier layers in microelectronics. Excellent resolution, photo resist compatibility, and minimal undercutting are readily achieved.
Features and Benefits
Use with Polyethylene tanks between 20°-50°C.
Etch Rates
25Å/sec @ 20°C,
50Å/sec @ 30°C.
Rinse with DI water
Etch Rates
25Å/sec @ 20°C,
50Å/sec @ 30°C.
Rinse with DI water
signalword
Danger
hcodes
Hazard Classifications
Acute Tox. 1 Dermal - Acute Tox. 2 Oral - Acute Tox. 3 Inhalation - Eye Dam. 1 - Skin Corr. 1A
Storage Class
6.1A - Combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter
Regulatory Information
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