643262
Gold coated silicon wafer
99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)
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Synonym(s):
gold coated silicon, gold coated wafer
Linear Formula:
Au
Molecular Weight:
196.97
MDL number:
UNSPSC Code:
12352300
PubChem Substance ID:
NACRES:
NA.23
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Quality Level
Assay
99.99% (Ti)
99.999% (Au)
diam. × thickness
4 in. × 500 μm
layer thickness
1000 Å
matrix attachment
Titanium, as adhesion layer used to bind the gold to the silicon wafer.
SMILES string
[Au]
InChI
1S/Au
InChI key
PCHJSUWPFVWCPO-UHFFFAOYSA-N
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General description
Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.
The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.
Application
Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.
Packaging
Packaging 1 set in single wafer shipper
WGK
WGK 3
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Regulatory Information
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Certificates of Analysis (COA)
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Find documentation for the products that you have recently purchased in the Document Library.
Aguilar, M. et al.
Surface Science, 482-485, 935-935 (2001)
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