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Merck
CN

929697

Sigma-Aldrich

ElectroGreen®

greener alternative

Butyl Cellosolve substitute for electronics, bio-sourced

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NACRES:
NA.05

等级

for electronic purposes

质量水平

蒸汽压

1.75 mmHg ( 20 °C)

描述

RelativeEvaporation rate: ~0.11

Hansen SolubilityParameters: SPd = 7.5; SPp = 3.8; SPh = 6.1

检测方案

≥99% (GC)

形式

liquid

环保替代产品特性

Design for Energy Efficiency
Use of Renewable Feedstocks
Learn more about the Principles of Green Chemistry.

杂质

≤0.2% Water (Karl Fischer)
≤1 ppm As, Cr, Cd, Cu, Hg, Mn, Ni, Pb, Zn, trace (ICP, each)

蒸发残留物

≤0.05%

颜色

clear

粘度

16.1  cP(20 °C)

bp

154 °C (Initial)

密度

0.954

环保替代产品分类

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一般描述

This ElectroGreen® solvent is made of bio-based (corn/beets derived) safer alternatives to replace synthetic butyl cellosolve fossil-based solvent with specifications tailored for electronics and energy applications. All our ElectroGreen® solvents line are derived from a renewable resource(verified through C14 ASTM D6866-16 testing). We are committed to bringing you Greener Alternative Products, which adhere to one or more of The 12 Principles of Greener Chemistry. Click here for more information.

This solvent blend consists of Ethyl lactate 70-90%, hexan-1-ol 30-50%.

应用

Our bio-based replacement for Butyl Cellosolve is perfect for cleaning in electronics, as well as ink formulations.
It is a precision cleaning solvent, dries completely, no film residue. It is also easy and inexpensive to distill/recycle, whilst no environmentally hazardous ingredients and no Hazardous Air Pollutants.
It is 20% to 30% more efficient in viscosity reduction than Butyl Cellosolve. It is an excellent solvency for ink formulations with high loading capacity.

法律信息

ElectroGreen is a registered trademark of Merck KGaA, Darmstadt, Germany

象形图

CorrosionExclamation mark

警示用语:

Danger

危险声明

危险分类

Eye Dam. 1 - STOT SE 3

靶器官

Respiratory system

WGK

WGK 1

闪点(°F)

141.0 °F

闪点(°C)

60.55 °C

法规信息

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Carbon-based Sustainable Organic Electronics (SOE) limit the use of critical elements and biodegrade at their end-of-life. This review offers insight on how structural and energy disorder in these materials influence device performance and includes evaluations of various transport models and their limitations.

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